IC & SENSOR PACKAGING EXPO JAPAN - CHIBA 2025

Related Industries Description Audience Cycle




 Electronic Design & Components   Measurement, Control & Testing  Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...
Trade Public once a year

Next Dates

Sept. 17 - 19, 2025  > in  Chiba (Japan - Asia - Pacific)  > Makuhari Messe - Nippon Convention Center
Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.

Venue

Makuhari Messe - Nippon Convention Center
Nakase 2-1, Mihama-ku
Chiba City 261-0023
Japan

 +81 043-296-0001
 +81 043-296-0529
 http://www.m-messe.co.jp/index.html
 ncc@m-messe.co.jp
Organizers

RX Japan
18F Shinjuku - Nomura Building
1-26-2 Nishishinjuku
Shinjuku - ku
Tokyo 163-0570
Japan
 +81 (0)3 3349-8501
 +81 (0)3 3349-8599
 http://www.rxjapan.jp/en
 info@reedexpo.co.jp
RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom
 +44 20 8271 2134
 +44 20 8910 7823
 http://rxglobal.com
 rxinfo@reedexpo.co.uk

More information

 http://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html
 icp-e@reedexpo.co.jp


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(Last updated: Sept. 10th 2024)