IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA 2025

Related Industries Description Audience Cycle
 Electronic Design & Components   Measurement, Control & Testing  Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...
 Trade Public once a year

Next Dates
Oct. 29 - 31, 2025  > in  Nagoya (Japan - Asia - Pacific)  > Nagoya International Exhibition Hall (Port Messe Nagoya)
Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.

Venue
Nagoya International Exhibition Hall (Port Messe Nagoya)
Nagoya
Japan
 +81 (052) 398-1771
 +81 (052) 398-1785
 http://www.nipc.city.nagoya.jp/pmn/
 niex@portmesse.jp
Organizers
RX Japan
18F Shinjuku - Nomura Building
1-26-2 Nishishinjuku
Shinjuku - ku
Tokyo 163-0570
Japan
 +81 (0)3 3349-8501
 +81 (0)3 3349-8599
 http://www.rxjapan.jp/en
 info@reedexpo.co.jp
RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom
 +44 20 8271 2134
 +44 20 8910 7823
 http://rxglobal.com
 rxinfo@reedexpo.co.uk

More information
 http://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html
 icp-e@reedexpo.co.jp


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(Last updated: Oct. 27th 2024)