| Related Industries |
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Description |
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Audience |
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Cycle |
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 Electronic Design & Components
Measurement, Control & Testing
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Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...
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Trade Public |
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once a year |
| Next Dates |
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| May 14 - 16, 2025 |
> in
Osaka (Japan - Asia - Pacific)
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> Intex Osaka
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| on May 2026 (?) |
> in
Osaka (Japan - Asia - Pacific)
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> Intex Osaka
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Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.
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Intex Osaka
1-5-102 Nanko-Kita, Suminoe-ku
Osaka, 559-0034
Japan
 +81 (0)6 6612 8800
 +81 (0)6 6612 8686
 http://www.intex-osaka.com
 web@intex-osaka.com
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RX Japan
18F Shinjuku - Nomura Building
1-26-2 Nishishinjuku
Shinjuku - ku
Tokyo 163-0570
Japan
+81 (0)3 3349-8501
+81 (0)3 3349-8599
http://www.rxjapan.jp/en
info@reedexpo.co.jp
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RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom
+44 20 8271 2134
+44 20 8910 7823
http://rxglobal.com
rxinfo@reedexpo.co.uk
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| More information |
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http://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html
icp-e@reedexpo.co.jp
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