IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2026

Related Industries Description Audience Cycle
 Electronic Design & Components   Measurement, Control & Testing  Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...
 Trade Public once a year

Next Dates
Jan. 21 - 23, 2026  > in  Tokyo (Japan - Asia - Pacific)  > Tokyo International Exhibition Center (Tokyo Big Sight)
Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.

Venue
Tokyo International Exhibition Center (Tokyo Big Sight)
3-21-1 Ariake
Koto-ku
Tokyo 135-0063
Japan
 +81 (0)3 5530 1111
 +81 (0)3 5530 1222
 http://www.bigsight.jp/english
Organizers
RX Japan
18F Shinjuku - Nomura Building
1-26-2 Nishishinjuku
Shinjuku - ku
Tokyo 163-0570
Japan
 +81 (0)3 3349-8501
 +81 (0)3 3349-8599
 http://www.rxjapan.jp/en
 info@reedexpo.co.jp
RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom
 +44 20 8271 2134
 +44 20 8910 7823
 http://rxglobal.com
 rxinfo@reedexpo.co.uk

More information
 http://www.nepconjapan.jp/tokyo/ja-jp.html
 icp-e@reedexpo.co.jp


EventsEye
Trade Show Calendar Worldwide
https://www.eventseye.com

(Last updated: Jan. 25th 2025)