IC & SENSOR PACKAGING EXPO 2024

Description

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Related industries

Electronic Design & Components Measurement, Control & Testing

Audience

Trade Public

Cycle

once a year

Date	City	Venue
Jan. 24 - 26, 2024	Tokyo (Japan)	Tokyo International Exhibition Center (Tokyo Big Sight)
on Jan. 2025 (?)	Tokyo (Japan)	Tokyo International Exhibition Center (Tokyo Big Sight)

Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.

Venue(s)

Venue for IC & SENSOR PACKAGING EXPO: Tokyo International Exhibition Center (Tokyo Big Sight) (Tokyo)

Tokyo International Exhibition Center (Tokyo Big Sight)
3-21-1 Ariake
Koto-ku
Tokyo 135-0063
Japan

+81 (0)3 5530 1111

+81 (0)3 5530 1222

Web Site E-mail

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Organizers(s)

All events from the organizer of IC & SENSOR PACKAGING EXPO

RX Japan
18F Shinjuku - Nomura Building
1-26-2 Nishishinjuku
Shinjuku - ku
Tokyo 163-0570
Japan

+81 (0)3 3349-8501

+81 (0)3 3349-8599

Web Site E-mail

All events from the organizer of IC & SENSOR PACKAGING EXPO

RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom

+44 20 8271 2134

+44 20 8910 7823

Web Site E-mail

Contact info for IC & SENSOR PACKAGING EXPO

Official Web Site

Event's E-mail Event's E-mail for exhibitors only

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Concurrent fairs (similar dates, same city)

CAR-ELE JAPAN - TOKYO INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW PWB EXPO - PRINTED WIRING BOARDS EXPO - TOKYO ELE EXPO INTERNEPCON JAPAN - TOKYO ROBODEX ELECTROTEST JAPAN - TOKYO NEPCON JAPAN SMART FACTORY EXPO (SFE) FINE PROCESS TECHNOLOGY EXPO

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(Last update: Jan. 18^th 2024)