| Related Industries |
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Description |
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Audience |
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Cycle |
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 Electronic Design & Components
Applied Computer & Industrial Engineering
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IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
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Trade Public |
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once a year |
| Next Dates |
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| Oct. 28 - 30, 2025 |
> in
Shenzhen (China - Asia - Pacific)
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> Shenzhen World Exhibition & Convention Center
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| on Oct. 2026 (?) |
> in
Shenzhen (China - Asia - Pacific)
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> Shenzhen World Exhibition & Convention Center
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Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.
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Shenzhen World Exhibition & Convention Center
No.1 Zhancheng Road
Fuhai Street
Bao’an District
Shenzhen, Guangdong
China
 +86 0755-32937926
 +86 0755-32937926
 http://www.shenzhen-world.com/en/index.html
 zhaomolei@cmhk.com
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RX China
15th Floor, Tower A, Pingan International Finance Center
No.1-3, Xinyuan South Road
Chaoyang District
Beijing 100027
China
+86 10 5933 9000
+86 10 5933 9333
http://rxglobal.com/rx-china
nancy.zhang@rxglobal.com
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RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom
+44 20 8271 2134
+44 20 8910 7823
http://rxglobal.com
rxinfo@reedexpo.co.uk
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| More information |
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http://www.nepconasia.com/en-gb/bandaoti/ic-pack.html
nancy.zhang@rxglobal.com
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