IC PACKAGING FAIR 2025

Description

IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...

Related industries

Electronic Design & Components Applied Computer & Industrial Engineering

Audience

Trade Public

Cycle

once a year

Date	City	Venue
Oct. 28 - 30, 2025	Shenzhen (China)	Shenzhen World Exhibition & Convention Center

Please note ! All dates are subject to changes. Contact organizers for more information before making arrangements.

Venue(s)

Venue for IC PACKAGING FAIR: Shenzhen World Exhibition & Convention Center (Shenzhen)

Shenzhen World Exhibition & Convention Center
No.1 Zhancheng Road
Fuhai Street
Bao’an District
Shenzhen, Guangdong
China

+86 0755-32937926

+86 0755-32937926

Web Site E-mail

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Organizers(s)

All events from the organizer of IC PACKAGING FAIR

RX China
15th Floor, Tower A, Pingan International Finance Center
No.1-3, Xinyuan South Road
Chaoyang District
Beijing 100027
China

+86 10 5933 9000

+86 10 5933 9333

Web Site E-mail

All events from the organizer of IC PACKAGING FAIR

RX Global Events
Gateway House
28 The Quadrant
Richmond, Surrey
TW9 1DN
UK - United Kingdom

+44 20 8271 2134

+44 20 8910 7823

Web Site E-mail

Contact info for IC PACKAGING FAIR

Official Web Site

Event's E-mail Event's E-mail for exhibitors only

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AUTOMOTIVE WORLD CHINA FILM & TAPE EXPO NEPCON ASIA C-TOUCH & DISPLAY SHENZHEN ICE CHINA

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(Last update: Jan. 26^th 2025)